Course Overview
Think safety first when working within semiconductor fabrication facilities. Become aware of the different types of hazardous energy that may injure or even kill you. Develop and practice a hazardous energy control program at your company using lockout/tagout procedures when servicing equipment or tools inside the fabrication facility.
Unexpected energization of semiconductor fabrication equipment being serviced or maintained can have fatal consequences. Take this course to learn how lockout/tagout procedures protect all employees and make the employees who perform maintenance and service work 100% responsible for their own safety. Ideal learners are semiconductor fabrication workers, especially authorized employees.
By the end of this course, you will be able to:
- Know the types of hazardous energy that may be present in semiconductor fabrication environments
- Recall the purpose of a hazardous energy control program
- Identify employer requirements to establish and use a hazardous energy control program
- Recall the responsibilities of three types of employee roles involved in a hazardous energy control program
- Choose the correct energy isolation method for different types of hazardous energies
- Differentiate between devices that do and do not isolate energy
- Distinguish between energy isolating devices that can and can't be locked out
- Know how lockout devices and adapters are used
- Recognize SEMI S2 guidelines for safety interlock systems
- Recognize SEMI S2 guidelines for hazardous energy isolation
- Order the steps in the lockout/tagout procedure
- Identify the requirements for each step in an effective lockout/tagout program
- Identify the steps to be taken following the completion of the maintenance
- Recognize when and how group LOTO may be used